Sort term project concerning Electronics HW, FW, SW, test-system, Analog and mixed-signal Semiconductor IC, PCB design and layout, Altium, Cadence.
Aktualisiert am 24.07.2024
Profil
Freiberufler / Selbstständiger
Remote-Arbeit
Verfügbar ab: 24.07.2024
Verfügbar zu: 100%
davon vor Ort: 20%
PCB
Halbleitertechnologie
firmware
Software
VHDL
C/C++
Python
Altium Designer
Cadence Design Systems
six sigma green belt
ATE
R&D
CMOS
MATLAB
Mini tab
Git
German
B1
English
Fluent/ Professional User
Hindi
Independent User
Bangla
Muttersprache
Dutch
Grundkenntnisse

Einsatzorte

Einsatzorte

Aachen (+300km)
Deutschland
möglich

Projekte

Projekte

12 years 3 months
2011-03 - 2023-05

PCBA design projects

Hardware Design Engineer
Hardware Design Engineer
  • I led full custom Automated Test Equipment (ATE) development activity using TEL-prober to test semiconductor wafer and diced wafer on foil (FFC). We used self-build tester electronic coupled with industry standard measurement equipment from Keithley (Tektronix) and Pickering Interface for a seamless control of equipment?s through LXI protocol with custom build FW and SW Platform. This custom-build ATE consists of multi-channel SMUs, PS, DMM, Wafer-prober, probe-card, relay driver card, switch-matrix, and Interface PCBAs driven by a cockpit software user interface. I delivered the architecture proposal along with methodologies to perform contact tests, ESD tests, functional tests and stress tests involving other stack holders. I also led tester platform?s FMEA and calibration procedure definition activities.
  • I led and supported multiple PCBA design projects for product and system development for industrialization. My responsibilities inclues component selection (BOM), PCB design, layout, and delegating production to supplies. Besides that, I also supported the packaging development from the sensor using Chip-on-Board, wire-bonding and TSV technologies.
  • I led the R&D project called ?Pathfinder?, where we designed multiple test chips (IC) targeting various applications using Digital-SiPM with readout structures. I drove the market analysis and conducted feasibility study to propose new sensor chip architecture. I led the complete design cycle from Transistor level design & layout for the full custom mixed signal chip. My team also prepared evaluation & Proof-of-concept setup preparation for Microscopy and Spectral CT application. I also delegate and mentor on-chip component design activities, packaging, and PCB design activities to colleagues, suppliers, and student workers. I also led activities for firmware and software development to characterization and verification of the sensors with radio-active sources.
  • I led and supported various activities for industrialization of the Geiger mode Digital Silicon Photo-Multiple sensors. This ultra-low light optical sensor is used for Nuclear-Medical Imaging, namely Digital Positron-Emission-Tomography (PET) product. I supported the development activities of our self-build final tester hardware platform to test several CTQ parameters in a controlled environment using Peltier-based temperature control. I supported Failure Analysis (FA) for silicon die & module PCB failures using electrical testing, optical microscopy, X-ray, and cross-section inspections. I also contributed to debugging and deployment of HW, FW and SW updates for the product module consisting of 4x4 sensors dies in a chip on board package with an embedded FPGA.
Philips GmbH
Aachen, Germany
1 year 2 months
2010-01 - 2011-02

bachelor courses

Sr. Lecturer
Sr. Lecturer
  • I lectured bachelor courses on circuit analysis, electrical machine, and basics of telecommunication engineering
  • I also supervised master's thesis works of multiple students
American International University of Bangladesh
Dhaka, Bangladesh
2 years 1 month
2007-02 - 2009-02

analog and mixed signal circuit design

Senior Analog IC Design Engineer
Senior Analog IC Design Engineer
  • I led the analog and mixed signal circuit design for the Ambient Light Sensor (ALS) IC design activity in CMOS 180nm Technology. My key responsibilities were competitor analysis, high dynamic range ADC design, LDO design, analog and mixed signal circuit design for testability, support prototype development and application characterization. During these projects, I took technical led for the technology transfer of ALS project from San-Jose, USA to Nijmegen, NL.
  • I actively contributed to chip design for power-supply controller in NXP ABCD process and supported industrialization.
  • I also supported the architecture development and circuit design for mixed signal IO and ESD pad cell design and qualification in TSMC CMOS 45nm process node. My key responsibilities were feasibility study, data sheet writing, IO cell design, characterization, verification and release.
NXP Semiconductor
Nijmegen, The Netherlands
11 months
2006-03 - 2007-01

miniature Endoscopes Image Sensor design

Senior Analog Design Engineer
Senior Analog Design Engineer
  • I led the chip design activities for the miniature Endoscopes Image Sensor design in UMC 180nm technology. My responsibility includes schematic design, full custom circuit and layout design for the entire readout electronics of the sensor chip.
  • In a second project, I led the chip design activities for a Fly-eye type image sensor development in XFAB 350nm Technology. During this project, my responsibility includes the definition of the sensor architecture, schematic and layout design of the custom IC development.
AWAIBA Lda.
Funchal, Portugal
1 year 4 months
2004-11 - 2006-02

Development voltage mode, gray code to pipeline DAC architecture

Master Thesis Student
Master Thesis Student
  • I developed an IP core for the voltage mode, gray code to pipeline DAC architecture
  • I led the prototype IC design and layout of the OTA circuit and DAC circuit in 180nm UMC technology
Research position - RaMSiS, IMIT, KTH
Sweden
7 months
2002-07 - 2003-01

bachelor thesis project

Research Associate
Research Associate
  • During my bachelor thesis project called (on request), we used Matlab?s neural network toolbox to classify vocal track model of a sample set of speakers to train a simple AI system.
DSP Lab, BUET
Bangladesh

Aus- und Weiterbildung

Aus- und Weiterbildung

2024

Online certification course

MBA Essentials, London School of Economics and Political Science (LSE)


Focus:

  • Leadership
  • Finance
  • Management
  • Accounting
  • Strategy, Influence and Organizational culture


2005

System-on-Chip Design

M.Sc.

Kungl Tekniska Högskolan - KTH, Stockholm, Sweden


Focus:

  • Low Power Analog and Mixed-signal IC?s
  • Packaging
  • Radio Electronics
  • Digital Integrated Circuits
  • Digital Design using HDL
  • Embedded systems
  • SoC Architectures and Digital System Engineering


2003

Electrical & Electronic Engineering

B.Sc.

BUET, Dhaka, Bangladesh


Focus:

  • Control System
  • Telecommunication Engineering
  • Power Electronic
  • Electrical Machines
  • Power system
  • Advanced Mathematics and Statistics

Kompetenzen

Kompetenzen

Top-Skills

PCB Halbleitertechnologie firmware Software VHDL C/C++ Python Altium Designer Cadence Design Systems six sigma green belt ATE R&D CMOS MATLAB Mini tab Git

Produkte / Standards / Erfahrungen / Methoden

Profile

  • I am an expert electronics engineer with extensive project management skills. I have a keen interest in utilizing my skills in hardware, firmware, and software to design automation sensors and systems for industrial applications. I am particularly enthusiastic about the potential of Artificial Intelligence, IoT, and Robotics to advance the quality of people's lives.
  • With more than 15 years of experience in the semiconductor industry, I have specialized in product development and testing for sensors and electronics. I possess expertise in Analog and Mixed-Signal Integrated Circuit (IC) and Printed Circuit Board (PCB) design and testing for optical sensors and systems. My experience includes writing requirement specifications, competitor analysis, system architecture proposals, implementation and verification, failure analysis (FA), and root cause analysis. Throughout my career, I have successfully led technical teams, managed projects, generated patents, and developed innovative ideas.
  • I excel in organizational skills, such as time management, planning, attention to detail, prioritization, effective communication, record-keeping, resource management, problem-solving, delegation, teamwork, and emotional intelligence. I strongly believe in continuous improvement in these areas.


INDUSTRIAL SKILLS

  • DfSS (Design for Six-Sigma) Green belt: DIDOV, Minitab, Statistical tools, Quality tools, Statistical process control (SPC), CTQ flow down, FMEA, Cause and Effect analysis, Design of Experiment (DoE) etc. Familiar with DMAIC and DMADV.
  • Project Management.
  • Familiar with ISO 9001, ISO 13485, Agile, Scrum and Dev-OP


TECHNICAL SKILLS

H/W Tools and Competences:

  • Analogue, Mixed signal IC design:
    • Cadence Virtuoso (Schematic Editing, Analog Design Environment, Layout XL), SKILL and Ocean scripting, Mentor graphics Calibre (DRC, LVS)
    • Cadence Assura
    • Cadence Diva (DRV, LVS)
    • Mentor ICFLOW (Design Architect
    • IC Station and IC verify for DRC-LVS), Simulator (Eldo, Spectre)
    • BISIM V3.3 Device Model, Noise analysis, Orcad SPICE, PSPICE, PSTAR
    • ADC, DAC, Band-Gap Reference circuit (BGR)
    • Switch-Capacitor Circuits
    • Time-to-Digital Converter (TDC)
    • Amplifier, OTA, Comparator
    • Current-Mirror
    • Biasing Circuits
    • LDO, SMPS
    • Memory-Cell
    • Sense Amplifier
    • Change-injection-cancelation
    • Slew-rate enhancement
    • Power-on-reset
    • Oscillator
    • Level-shifter, LVDS
    • Charge pump
    • SERDES, VCO, PLL
    • Device physics know-how to optimize Analog circuit
  • PCB Design:
    • Altium Designer (PCB schematic & layout)
    • SPICE
    • PCBA
    • SMD
    • Wire-Bonding
    • TSV
    • multilayer
    • high-speed
    • fine-pitch
    • CSP
    • FPGA layout
    • signal integrity
    • current sense
    • measurement, and supply circuit using standard ADC/DAC/LDO and programmable current source etc.

  • Digital Design:
    • VHDL Programming
    • Mentor HDL Designer
    • Sigasi VHDL Editor
    • Vivado
    • Synthesis
    • Place and Route and Implementation for Xilinx FPGAs, timing report
    • constrain file
    • Xillinx ISE
    • Mentor Graphics Modelsim
    • Cadence NCSIM
    • Synopsys design compiler
    • Micro-controller programming
    • Familiar with various I/O interface protocols (e.g., I2C, SPI, JTAG and USB)
    • IP reuse and error handling etc.

  • System Modeling:
    • V-Model
    • MBSE
    • UML
    • SysML
    • Cameo
    • Matlab


Lab-Instruments:

  • Oscilloscope
  • SMU
  • PSU
  • Spectrum Analyzer
  • Parameter Analyzer
  • Spectroscope
  • Soldering
  • Multi-meter
  • Automation using programming languages though GPIB, RS232, I2C, USB and Ethernet protocols


Applications:

  • Visual studio code
  • Copilot
  • Eclipse
  • Minitab
  • Office Applications
  • OneNote
  • Latex
  • MS Visio
  • OpenSCAD
  • GitHub
  • ChatGPT etc.

Betriebssysteme

Linux
Windows
Mac-OS
UNIX

Programmiersprachen

C/C++
Shell Scripting
Python
AWK
TCL-TK
Visual Basic
Java
Git

Einsatzorte

Einsatzorte

Aachen (+300km)
Deutschland
möglich

Projekte

Projekte

12 years 3 months
2011-03 - 2023-05

PCBA design projects

Hardware Design Engineer
Hardware Design Engineer
  • I led full custom Automated Test Equipment (ATE) development activity using TEL-prober to test semiconductor wafer and diced wafer on foil (FFC). We used self-build tester electronic coupled with industry standard measurement equipment from Keithley (Tektronix) and Pickering Interface for a seamless control of equipment?s through LXI protocol with custom build FW and SW Platform. This custom-build ATE consists of multi-channel SMUs, PS, DMM, Wafer-prober, probe-card, relay driver card, switch-matrix, and Interface PCBAs driven by a cockpit software user interface. I delivered the architecture proposal along with methodologies to perform contact tests, ESD tests, functional tests and stress tests involving other stack holders. I also led tester platform?s FMEA and calibration procedure definition activities.
  • I led and supported multiple PCBA design projects for product and system development for industrialization. My responsibilities inclues component selection (BOM), PCB design, layout, and delegating production to supplies. Besides that, I also supported the packaging development from the sensor using Chip-on-Board, wire-bonding and TSV technologies.
  • I led the R&D project called ?Pathfinder?, where we designed multiple test chips (IC) targeting various applications using Digital-SiPM with readout structures. I drove the market analysis and conducted feasibility study to propose new sensor chip architecture. I led the complete design cycle from Transistor level design & layout for the full custom mixed signal chip. My team also prepared evaluation & Proof-of-concept setup preparation for Microscopy and Spectral CT application. I also delegate and mentor on-chip component design activities, packaging, and PCB design activities to colleagues, suppliers, and student workers. I also led activities for firmware and software development to characterization and verification of the sensors with radio-active sources.
  • I led and supported various activities for industrialization of the Geiger mode Digital Silicon Photo-Multiple sensors. This ultra-low light optical sensor is used for Nuclear-Medical Imaging, namely Digital Positron-Emission-Tomography (PET) product. I supported the development activities of our self-build final tester hardware platform to test several CTQ parameters in a controlled environment using Peltier-based temperature control. I supported Failure Analysis (FA) for silicon die & module PCB failures using electrical testing, optical microscopy, X-ray, and cross-section inspections. I also contributed to debugging and deployment of HW, FW and SW updates for the product module consisting of 4x4 sensors dies in a chip on board package with an embedded FPGA.
Philips GmbH
Aachen, Germany
1 year 2 months
2010-01 - 2011-02

bachelor courses

Sr. Lecturer
Sr. Lecturer
  • I lectured bachelor courses on circuit analysis, electrical machine, and basics of telecommunication engineering
  • I also supervised master's thesis works of multiple students
American International University of Bangladesh
Dhaka, Bangladesh
2 years 1 month
2007-02 - 2009-02

analog and mixed signal circuit design

Senior Analog IC Design Engineer
Senior Analog IC Design Engineer
  • I led the analog and mixed signal circuit design for the Ambient Light Sensor (ALS) IC design activity in CMOS 180nm Technology. My key responsibilities were competitor analysis, high dynamic range ADC design, LDO design, analog and mixed signal circuit design for testability, support prototype development and application characterization. During these projects, I took technical led for the technology transfer of ALS project from San-Jose, USA to Nijmegen, NL.
  • I actively contributed to chip design for power-supply controller in NXP ABCD process and supported industrialization.
  • I also supported the architecture development and circuit design for mixed signal IO and ESD pad cell design and qualification in TSMC CMOS 45nm process node. My key responsibilities were feasibility study, data sheet writing, IO cell design, characterization, verification and release.
NXP Semiconductor
Nijmegen, The Netherlands
11 months
2006-03 - 2007-01

miniature Endoscopes Image Sensor design

Senior Analog Design Engineer
Senior Analog Design Engineer
  • I led the chip design activities for the miniature Endoscopes Image Sensor design in UMC 180nm technology. My responsibility includes schematic design, full custom circuit and layout design for the entire readout electronics of the sensor chip.
  • In a second project, I led the chip design activities for a Fly-eye type image sensor development in XFAB 350nm Technology. During this project, my responsibility includes the definition of the sensor architecture, schematic and layout design of the custom IC development.
AWAIBA Lda.
Funchal, Portugal
1 year 4 months
2004-11 - 2006-02

Development voltage mode, gray code to pipeline DAC architecture

Master Thesis Student
Master Thesis Student
  • I developed an IP core for the voltage mode, gray code to pipeline DAC architecture
  • I led the prototype IC design and layout of the OTA circuit and DAC circuit in 180nm UMC technology
Research position - RaMSiS, IMIT, KTH
Sweden
7 months
2002-07 - 2003-01

bachelor thesis project

Research Associate
Research Associate
  • During my bachelor thesis project called (on request), we used Matlab?s neural network toolbox to classify vocal track model of a sample set of speakers to train a simple AI system.
DSP Lab, BUET
Bangladesh

Aus- und Weiterbildung

Aus- und Weiterbildung

2024

Online certification course

MBA Essentials, London School of Economics and Political Science (LSE)


Focus:

  • Leadership
  • Finance
  • Management
  • Accounting
  • Strategy, Influence and Organizational culture


2005

System-on-Chip Design

M.Sc.

Kungl Tekniska Högskolan - KTH, Stockholm, Sweden


Focus:

  • Low Power Analog and Mixed-signal IC?s
  • Packaging
  • Radio Electronics
  • Digital Integrated Circuits
  • Digital Design using HDL
  • Embedded systems
  • SoC Architectures and Digital System Engineering


2003

Electrical & Electronic Engineering

B.Sc.

BUET, Dhaka, Bangladesh


Focus:

  • Control System
  • Telecommunication Engineering
  • Power Electronic
  • Electrical Machines
  • Power system
  • Advanced Mathematics and Statistics

Kompetenzen

Kompetenzen

Top-Skills

PCB Halbleitertechnologie firmware Software VHDL C/C++ Python Altium Designer Cadence Design Systems six sigma green belt ATE R&D CMOS MATLAB Mini tab Git

Produkte / Standards / Erfahrungen / Methoden

Profile

  • I am an expert electronics engineer with extensive project management skills. I have a keen interest in utilizing my skills in hardware, firmware, and software to design automation sensors and systems for industrial applications. I am particularly enthusiastic about the potential of Artificial Intelligence, IoT, and Robotics to advance the quality of people's lives.
  • With more than 15 years of experience in the semiconductor industry, I have specialized in product development and testing for sensors and electronics. I possess expertise in Analog and Mixed-Signal Integrated Circuit (IC) and Printed Circuit Board (PCB) design and testing for optical sensors and systems. My experience includes writing requirement specifications, competitor analysis, system architecture proposals, implementation and verification, failure analysis (FA), and root cause analysis. Throughout my career, I have successfully led technical teams, managed projects, generated patents, and developed innovative ideas.
  • I excel in organizational skills, such as time management, planning, attention to detail, prioritization, effective communication, record-keeping, resource management, problem-solving, delegation, teamwork, and emotional intelligence. I strongly believe in continuous improvement in these areas.


INDUSTRIAL SKILLS

  • DfSS (Design for Six-Sigma) Green belt: DIDOV, Minitab, Statistical tools, Quality tools, Statistical process control (SPC), CTQ flow down, FMEA, Cause and Effect analysis, Design of Experiment (DoE) etc. Familiar with DMAIC and DMADV.
  • Project Management.
  • Familiar with ISO 9001, ISO 13485, Agile, Scrum and Dev-OP


TECHNICAL SKILLS

H/W Tools and Competences:

  • Analogue, Mixed signal IC design:
    • Cadence Virtuoso (Schematic Editing, Analog Design Environment, Layout XL), SKILL and Ocean scripting, Mentor graphics Calibre (DRC, LVS)
    • Cadence Assura
    • Cadence Diva (DRV, LVS)
    • Mentor ICFLOW (Design Architect
    • IC Station and IC verify for DRC-LVS), Simulator (Eldo, Spectre)
    • BISIM V3.3 Device Model, Noise analysis, Orcad SPICE, PSPICE, PSTAR
    • ADC, DAC, Band-Gap Reference circuit (BGR)
    • Switch-Capacitor Circuits
    • Time-to-Digital Converter (TDC)
    • Amplifier, OTA, Comparator
    • Current-Mirror
    • Biasing Circuits
    • LDO, SMPS
    • Memory-Cell
    • Sense Amplifier
    • Change-injection-cancelation
    • Slew-rate enhancement
    • Power-on-reset
    • Oscillator
    • Level-shifter, LVDS
    • Charge pump
    • SERDES, VCO, PLL
    • Device physics know-how to optimize Analog circuit
  • PCB Design:
    • Altium Designer (PCB schematic & layout)
    • SPICE
    • PCBA
    • SMD
    • Wire-Bonding
    • TSV
    • multilayer
    • high-speed
    • fine-pitch
    • CSP
    • FPGA layout
    • signal integrity
    • current sense
    • measurement, and supply circuit using standard ADC/DAC/LDO and programmable current source etc.

  • Digital Design:
    • VHDL Programming
    • Mentor HDL Designer
    • Sigasi VHDL Editor
    • Vivado
    • Synthesis
    • Place and Route and Implementation for Xilinx FPGAs, timing report
    • constrain file
    • Xillinx ISE
    • Mentor Graphics Modelsim
    • Cadence NCSIM
    • Synopsys design compiler
    • Micro-controller programming
    • Familiar with various I/O interface protocols (e.g., I2C, SPI, JTAG and USB)
    • IP reuse and error handling etc.

  • System Modeling:
    • V-Model
    • MBSE
    • UML
    • SysML
    • Cameo
    • Matlab


Lab-Instruments:

  • Oscilloscope
  • SMU
  • PSU
  • Spectrum Analyzer
  • Parameter Analyzer
  • Spectroscope
  • Soldering
  • Multi-meter
  • Automation using programming languages though GPIB, RS232, I2C, USB and Ethernet protocols


Applications:

  • Visual studio code
  • Copilot
  • Eclipse
  • Minitab
  • Office Applications
  • OneNote
  • Latex
  • MS Visio
  • OpenSCAD
  • GitHub
  • ChatGPT etc.

Betriebssysteme

Linux
Windows
Mac-OS
UNIX

Programmiersprachen

C/C++
Shell Scripting
Python
AWK
TCL-TK
Visual Basic
Java
Git

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